HALF MOON BAY, Calif. -- Despite the push towards 450-mm fabs in some circles, the next-generation wafer size is not expected within the next decade, according to an analyst.
Intel Corp., for one, is looking at 450-mm fabs, reportedly in the 2012 time frame. Samsung, TSMC and Toshiba have also talked about building 450-mm fabs.
"450-mm will happen," said G. Dan Hutcheson, CEO of VLSI Research Inc., at this week's Industry Strategy Symposium (ISS) here.
"People are starting to work on the handling issues, but I never believed 2012 is a viable date," he said, adding that 450-mm fabs could possibly appear in the 2020-to-2025 time frame.
Here's what is required for 450-mm wafers in the industry: $3-to-$4 billion in R&D funding and "a real fab to make it happen," he said.
出處：[EETimes]
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酷評：敢問就是台積電的12寸厂的loading是多少？450mm？算暸吧，出來的話，一個個lot都沒人抬的動...
Monday, January 21, 2008
450-mm fabs not seen in short term
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